完整32 × 64位SRAM阵列(包括感测放大器和写驱动器)在处理器活动下的BTI和HCD退化

Victor M. van Santen, Simon Thomann, Chaitanya Pasupuleti, P. Genssler, Narendra Gangwar, Uma Sharma, J. Henkel, S. Mahapatra, H. Amrouch
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引用次数: 13

摘要

我们首次在32x64单元SRAM阵列中进行了BTI和HCD退化的研究,该阵列包括感测放大器(SA),写驱动器(WD)和预充电电路(每个64列),这些电路由商业处理器的工作负载诱导的活动刺激。在不到2小时的时间里,我们的全自动框架利用提取的活动来创建SPICE模拟(SRAM阵列,SA, WD)中使用的电压波形,并在BTI和HCD模型中使用各自显示的电压作为刺激来降解晶体管。我们支持不同的温度,电源电压(包括DVFS), SRAM, SA和WD设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
BTI and HCD Degradation in a Complete 32 × 64 bit SRAM Array – including Sense Amplifiers and Write Drivers – under Processor Activity
For the first time, we present a study of BTI and HCD degradation in a 32 × 64 cell SRAM array including Sense Amplifiers (SA), Write Drivers (WD) and pre-charging circuitry (one each for 64 columns) stimulated by the workload-induced activity of a commercial processor. In under 2 hours, our fully automated framework employs the extracted activities to create voltage waveforms used in SPICE simulations (SRAM Array, SA, WD) and degrades transistors using their individual exhibited voltages as stimuli in BTI and HCD models. We support different temperatures, supply voltages (including DVFS), SRAM, SA and WD designs.
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