{"title":"设计节能的移动平台","authors":"T. Rahal-Arabi, A. Muhtaroğlu, G. Taylor","doi":"10.1109/SPI.2007.4512192","DOIUrl":null,"url":null,"abstract":"In this presentation we overview the multi-discipline low power platform architecture and where improvements were made, we will show examples of low power innovations in process technology, microprocessor design, IO signaling and IO power delivery subsystems. We will show these innovations and techniques resulted in energy efficient mobile computing to the end user. We will end the presentation with industry trends and future challenges for low power designs.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Designing for energy efficient mobile platforms\",\"authors\":\"T. Rahal-Arabi, A. Muhtaroğlu, G. Taylor\",\"doi\":\"10.1109/SPI.2007.4512192\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this presentation we overview the multi-discipline low power platform architecture and where improvements were made, we will show examples of low power innovations in process technology, microprocessor design, IO signaling and IO power delivery subsystems. We will show these innovations and techniques resulted in energy efficient mobile computing to the end user. We will end the presentation with industry trends and future challenges for low power designs.\",\"PeriodicalId\":206352,\"journal\":{\"name\":\"2007 IEEE Workshop on Signal Propagation on Interconnects\",\"volume\":\"47 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Workshop on Signal Propagation on Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2007.4512192\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2007.4512192","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this presentation we overview the multi-discipline low power platform architecture and where improvements were made, we will show examples of low power innovations in process technology, microprocessor design, IO signaling and IO power delivery subsystems. We will show these innovations and techniques resulted in energy efficient mobile computing to the end user. We will end the presentation with industry trends and future challenges for low power designs.