改进的InSb接口的特性

J. Langan, C. Viswanathan, C. A. Merilainen, J. Santarosa
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引用次数: 58

摘要

采用低温化学气相沉积法(LTCVD)制备了n型InSb表面。通过适当的工艺在InSb表面保存薄的天然氧化物,可以得到表面态密度< 1010ev -1cm-2的MIS器件,并且没有C-V迟滞。这些结果被MIS样品的电导测量证实。采用AES和XPS技术对LTCVD前后天然氧化物的化学性质和厚度进行了测定。这些数据表明,in的氧化状态的变化取决于氧化表面硅烷解离发生的程度。MIS器件的电学结果与这些差异相关;在垂直CVD反应器中,以非均相反应为主,表面态密度降至中高1011ev -1cm-2范围。由于LTCVD氧化物的粒度引起的表面电位波动,C-V测量变得复杂。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of improved InSb interfaces
Improved quality surfaces on n-type InSb have been produced using a low-temperature chemical vapor deposition (LTCVD) of SiO2. Preservation of the thin, natural oxide on the InSb surface through a suitable process results in MIS devices with a surface state density < 1010eV-1cm-2without C-V hysteresis. These results are confirmed by conductance measurements on MIS samples. The chemical identification and thickness of the natural oxide both before and after the LTCVD process was determined by using AES and XPS techniques. These data show a change in the oxidation sate of In depending on the degree to which silane dissociation occurs on the oxide surface. The electrical results on MIS devices correlation with these differences; surface state density degrade to the middle to high 1011eV-1cm-2range for the predominantly heterogeneous reaction resulting from a vertical CVD reactor. The C-V measurements are complicated by the presence of surface potential fluctuations caused by the granularity of the LTCVD oxide.
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