{"title":"碳化硅器件和工艺的现状与未来","authors":"M. Ostling, H. Lee, M. Domeij, C. Zetterling","doi":"10.1109/MIXDES.2006.1706532","DOIUrl":null,"url":null,"abstract":"Silicon carbide electronic devices are already commercially available in a few application areas such as high voltage rectifiers and emerging RF power amplifiers. Over the past 15 years a very rapid progress of both materials and device quality has been seen and is very encouraging for the near future application market. Prototype devices show amazing improvement each year in all device categories as well as a markedly improved wafer quality. However, materials defect issues are still limiting economically viable production of large area devices with high yield. In this paper a thorough review of progress in SiC device process technology and presents the state-of-the art SiC devices as well as new application areas such as ferroelectric field effect transistors","PeriodicalId":318768,"journal":{"name":"Proceedings of the International Conference Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Silicon carbide devices and processes - present status and future pers\",\"authors\":\"M. Ostling, H. Lee, M. Domeij, C. Zetterling\",\"doi\":\"10.1109/MIXDES.2006.1706532\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Silicon carbide electronic devices are already commercially available in a few application areas such as high voltage rectifiers and emerging RF power amplifiers. Over the past 15 years a very rapid progress of both materials and device quality has been seen and is very encouraging for the near future application market. Prototype devices show amazing improvement each year in all device categories as well as a markedly improved wafer quality. However, materials defect issues are still limiting economically viable production of large area devices with high yield. In this paper a thorough review of progress in SiC device process technology and presents the state-of-the art SiC devices as well as new application areas such as ferroelectric field effect transistors\",\"PeriodicalId\":318768,\"journal\":{\"name\":\"Proceedings of the International Conference Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006.\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-06-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MIXDES.2006.1706532\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference Mixed Design of Integrated Circuits and System, 2006. MIXDES 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MIXDES.2006.1706532","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Silicon carbide devices and processes - present status and future pers
Silicon carbide electronic devices are already commercially available in a few application areas such as high voltage rectifiers and emerging RF power amplifiers. Over the past 15 years a very rapid progress of both materials and device quality has been seen and is very encouraging for the near future application market. Prototype devices show amazing improvement each year in all device categories as well as a markedly improved wafer quality. However, materials defect issues are still limiting economically viable production of large area devices with high yield. In this paper a thorough review of progress in SiC device process technology and presents the state-of-the art SiC devices as well as new application areas such as ferroelectric field effect transistors