Ming-Da Tsai, Song-Yu Yang, Chi-Yao Yu, Ping-Yu Chen, Tzung-Han Wu, Mohammed Hassan, Chi-Tsan Chen, Chao-Wei Wang, Yen-Chuan Huang, Li-Han Huang, W. Chiu, A. Lin, Bo-Yu Lin, Arnaud Werquin, Chien-Cheng Lin, Yen-Horng Chen, Jen-Che Tsai, Yuan-Yu Fu, B. Tenbroek, Chinq-Shiun Chiu, Yi-Bin Lee, G. Dehng
{"title":"5G应用的RFIC和RF模块","authors":"Ming-Da Tsai, Song-Yu Yang, Chi-Yao Yu, Ping-Yu Chen, Tzung-Han Wu, Mohammed Hassan, Chi-Tsan Chen, Chao-Wei Wang, Yen-Chuan Huang, Li-Han Huang, W. Chiu, A. Lin, Bo-Yu Lin, Arnaud Werquin, Chien-Cheng Lin, Yen-Horng Chen, Jen-Che Tsai, Yuan-Yu Fu, B. Tenbroek, Chinq-Shiun Chiu, Yi-Bin Lee, G. Dehng","doi":"10.1109/VLSI-DAT49148.2020.9196407","DOIUrl":null,"url":null,"abstract":"In this work, a 12nm CMOS 2/3/4/5G multi-RAT (Radio Access Technology) XCVR is presented, capable of supporting up to 6 inter-band CA DL with flexible 4x4 MIMO port selection and 2 inter-band CA UL with coherent 2x2 MIMO. In NR 200MHz 4x4 MIMO 256QAM mode a throughput up to 5Gbps can be achieved. This work is housed in 2-layer Flip-Chip Chip-Scale Package (FCCSP).","PeriodicalId":235460,"journal":{"name":"2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"RFIC and RF Module for 5G Applications\",\"authors\":\"Ming-Da Tsai, Song-Yu Yang, Chi-Yao Yu, Ping-Yu Chen, Tzung-Han Wu, Mohammed Hassan, Chi-Tsan Chen, Chao-Wei Wang, Yen-Chuan Huang, Li-Han Huang, W. Chiu, A. Lin, Bo-Yu Lin, Arnaud Werquin, Chien-Cheng Lin, Yen-Horng Chen, Jen-Che Tsai, Yuan-Yu Fu, B. Tenbroek, Chinq-Shiun Chiu, Yi-Bin Lee, G. Dehng\",\"doi\":\"10.1109/VLSI-DAT49148.2020.9196407\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a 12nm CMOS 2/3/4/5G multi-RAT (Radio Access Technology) XCVR is presented, capable of supporting up to 6 inter-band CA DL with flexible 4x4 MIMO port selection and 2 inter-band CA UL with coherent 2x2 MIMO. In NR 200MHz 4x4 MIMO 256QAM mode a throughput up to 5Gbps can be achieved. This work is housed in 2-layer Flip-Chip Chip-Scale Package (FCCSP).\",\"PeriodicalId\":235460,\"journal\":{\"name\":\"2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)\",\"volume\":\"109 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSI-DAT49148.2020.9196407\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-DAT49148.2020.9196407","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this work, a 12nm CMOS 2/3/4/5G multi-RAT (Radio Access Technology) XCVR is presented, capable of supporting up to 6 inter-band CA DL with flexible 4x4 MIMO port selection and 2 inter-band CA UL with coherent 2x2 MIMO. In NR 200MHz 4x4 MIMO 256QAM mode a throughput up to 5Gbps can be achieved. This work is housed in 2-layer Flip-Chip Chip-Scale Package (FCCSP).
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