D. Elmhurst, R. Bains, T. Bressie, C. Bueb, E. Carrieri, B. Chauhan, N. Chrisman, M. Dayley, R. De Luna, K. Fan, M. Goldman, P. Govindu, A. Huq, M. Khandaker, J. Kreifels, S. Krishnamachari, P. Lavapie, K. Loe, T. Ly, F. Marvin, R. Melcher, S. Monasa, Q. Nguyen, B. Pathak, A. Proescholdt, T. Rahman, B. Srinivasan, R. Sundaram, P. Walimbe, D. Ward, D. Zeng, H. Zhang
{"title":"一个1.8 V 128 Mb 125 MHz多级单元闪存具有灵活的读同时写","authors":"D. Elmhurst, R. Bains, T. Bressie, C. Bueb, E. Carrieri, B. Chauhan, N. Chrisman, M. Dayley, R. De Luna, K. Fan, M. Goldman, P. Govindu, A. Huq, M. Khandaker, J. Kreifels, S. Krishnamachari, P. Lavapie, K. Loe, T. Ly, F. Marvin, R. Melcher, S. Monasa, Q. Nguyen, B. Pathak, A. Proescholdt, T. Rahman, B. Srinivasan, R. Sundaram, P. Walimbe, D. Ward, D. Zeng, H. Zhang","doi":"10.1109/ISSCC.2003.1234304","DOIUrl":null,"url":null,"abstract":"A 128 Mb flash memory with a two bit-per-cell design on a 0.13 /spl mu/m technology achieves a random access time of 55 ns and 125 MHz synchronous operation. The design incorporates a flexible multi-partition memory architecture which allows a program or erase operation to occur in one partition of the memory while bursting data out of another partition. The die is 27.3 mm/sup 2/ with a 0.154 /spl mu/m/sup 2/ cell size.","PeriodicalId":171288,"journal":{"name":"2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC.","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":"{\"title\":\"A 1.8 V 128 Mb 125 MHz multi-level cell flash memory with flexible read while write\",\"authors\":\"D. Elmhurst, R. Bains, T. Bressie, C. Bueb, E. Carrieri, B. Chauhan, N. Chrisman, M. Dayley, R. De Luna, K. Fan, M. Goldman, P. Govindu, A. Huq, M. Khandaker, J. Kreifels, S. Krishnamachari, P. Lavapie, K. Loe, T. Ly, F. Marvin, R. Melcher, S. Monasa, Q. Nguyen, B. Pathak, A. Proescholdt, T. Rahman, B. Srinivasan, R. Sundaram, P. Walimbe, D. Ward, D. Zeng, H. Zhang\",\"doi\":\"10.1109/ISSCC.2003.1234304\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 128 Mb flash memory with a two bit-per-cell design on a 0.13 /spl mu/m technology achieves a random access time of 55 ns and 125 MHz synchronous operation. The design incorporates a flexible multi-partition memory architecture which allows a program or erase operation to occur in one partition of the memory while bursting data out of another partition. The die is 27.3 mm/sup 2/ with a 0.154 /spl mu/m/sup 2/ cell size.\",\"PeriodicalId\":171288,\"journal\":{\"name\":\"2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC.\",\"volume\":\"109 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"22\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.2003.1234304\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2003.1234304","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 1.8 V 128 Mb 125 MHz multi-level cell flash memory with flexible read while write
A 128 Mb flash memory with a two bit-per-cell design on a 0.13 /spl mu/m technology achieves a random access time of 55 ns and 125 MHz synchronous operation. The design incorporates a flexible multi-partition memory architecture which allows a program or erase operation to occur in one partition of the memory while bursting data out of another partition. The die is 27.3 mm/sup 2/ with a 0.154 /spl mu/m/sup 2/ cell size.