Comparative Study of Sextupole and Quadrupole Magnetic Field in an ECR-PE Sputtering System

In the era of nanotechnology, VLSI industry employs various deposition methods and techniques to develop various sensors & devices, utilized in numerous applications. The commonly used deposition methods e.g., ALD, MBE, Vacuum Evaporation, CVD, PLD, Sputtering etc. are mostly dedicated for specific sets of deposition. Some of the methods are even extremely sophisticated, expensive or lack precision. Electron Cyclotron Resonance Plasma Enhanced (ECR-PE) multipurpose nano-film deposition system is one such unique apparatus that is in-house designed & developed to deposit high quality thin films of various metals and non-metals. Both, Plasma Enhanced Chemical Vapour Deposition (PE-CVD) arrangement and Sputter deposition arrangement is designed in the same plasma reactor considering permanent magnets. Although, the PE-CVD setup is already developed and made operational using a permanent magnet return yoke structure, the fabrication of the sputtering setup is yet to be carried out for its accommodation in the system. In this study, two annular permanent magnet assembly consisting of six (sextupole) and four (quadrupole) dipole magnets have been designed and simulated to study magnetic field distribution inside reactor for the sputter deposition arrangement.