T. Olbrich, I. Grout, Y. E. Aimine, A. Richardson, J. Contensou
{"title":"一种新的混合信号和模拟集成电路质量估计方法","authors":"T. Olbrich, I. Grout, Y. E. Aimine, A. Richardson, J. Contensou","doi":"10.1109/EDTC.1997.582419","DOIUrl":null,"url":null,"abstract":"IC product quality is commonly described as the faulty device level at shipment and is becoming an increasingly important metric in the Microelectronics Industry. This paper presents and demonstrates a quality estimation approach based on Inductive Fault Analysis for mixed-signal and analogue ICs, that quantitatively models the quality related parameters prior to production. It is shown how the approach can be used to optimise the manufacturing test program.","PeriodicalId":297301,"journal":{"name":"Proceedings European Design and Test Conference. ED & TC 97","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A new quality estimation methodology for mixed-signal and analogue ICs\",\"authors\":\"T. Olbrich, I. Grout, Y. E. Aimine, A. Richardson, J. Contensou\",\"doi\":\"10.1109/EDTC.1997.582419\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"IC product quality is commonly described as the faulty device level at shipment and is becoming an increasingly important metric in the Microelectronics Industry. This paper presents and demonstrates a quality estimation approach based on Inductive Fault Analysis for mixed-signal and analogue ICs, that quantitatively models the quality related parameters prior to production. It is shown how the approach can be used to optimise the manufacturing test program.\",\"PeriodicalId\":297301,\"journal\":{\"name\":\"Proceedings European Design and Test Conference. ED & TC 97\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-03-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings European Design and Test Conference. ED & TC 97\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTC.1997.582419\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings European Design and Test Conference. ED & TC 97","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTC.1997.582419","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new quality estimation methodology for mixed-signal and analogue ICs
IC product quality is commonly described as the faulty device level at shipment and is becoming an increasingly important metric in the Microelectronics Industry. This paper presents and demonstrates a quality estimation approach based on Inductive Fault Analysis for mixed-signal and analogue ICs, that quantitatively models the quality related parameters prior to production. It is shown how the approach can be used to optimise the manufacturing test program.
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