光掩模和电路设计复杂性的实现

P. Buck, F. Kalk, C. West
{"title":"光掩模和电路设计复杂性的实现","authors":"P. Buck, F. Kalk, C. West","doi":"10.1109/ISQED.2010.5450555","DOIUrl":null,"url":null,"abstract":"Photomasks have evolved from simple replicators of design layout for lithography to become complex translators of design intent for sub-wavelength imaging systems while at the same time maintaining a cost efficiency that exceeds Moore's Law predictions for scalability in the semiconductor industry. The cost performance of photomasks is reviewed in context to design costs. The life cycle of a photomask product node is examined with respect to capital investment costs. Predictions for future photomask cost challenges are considered.","PeriodicalId":369046,"journal":{"name":"2010 11th International Symposium on Quality Electronic Design (ISQED)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Photomasks and the enablement of circuit design complexity\",\"authors\":\"P. Buck, F. Kalk, C. West\",\"doi\":\"10.1109/ISQED.2010.5450555\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Photomasks have evolved from simple replicators of design layout for lithography to become complex translators of design intent for sub-wavelength imaging systems while at the same time maintaining a cost efficiency that exceeds Moore's Law predictions for scalability in the semiconductor industry. The cost performance of photomasks is reviewed in context to design costs. The life cycle of a photomask product node is examined with respect to capital investment costs. Predictions for future photomask cost challenges are considered.\",\"PeriodicalId\":369046,\"journal\":{\"name\":\"2010 11th International Symposium on Quality Electronic Design (ISQED)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 11th International Symposium on Quality Electronic Design (ISQED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2010.5450555\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Symposium on Quality Electronic Design (ISQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2010.5450555","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

光掩膜已经从光刻设计布局的简单复制器发展成为亚波长成像系统设计意图的复杂翻译者,同时保持超过半导体行业摩尔定律预测的可扩展性的成本效率。从设计成本的角度对光掩膜的性价比进行了综述。光掩膜产品节点的生命周期与资本投资成本有关。对未来光掩膜成本挑战的预测进行了考虑。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Photomasks and the enablement of circuit design complexity
Photomasks have evolved from simple replicators of design layout for lithography to become complex translators of design intent for sub-wavelength imaging systems while at the same time maintaining a cost efficiency that exceeds Moore's Law predictions for scalability in the semiconductor industry. The cost performance of photomasks is reviewed in context to design costs. The life cycle of a photomask product node is examined with respect to capital investment costs. Predictions for future photomask cost challenges are considered.
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