污染引起焊盘腐蚀的研究

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2019-07-01 DOI:10.1109/IPFA47161.2019.8984817

Hao Gan, Lin Shi, Xiuqun Zhang, Hongsheng Dai

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引用次数: 0

摘要

本文介绍了一种典型的集成电路腐蚀现象。三端可调分流稳压器由于Vref引脚打开而在PCBA上输出异常电压。通过SEM&EDX分析证实焊盘腐蚀。电板对周围的原理图是开放的。经过全面调查，确认有几批硅片被脱模过程中引入的硅油污染。成型料与模具之间发生分层。镀锡过程中，含有氯和硫的镀液渗入包装内。建议调节器供应商改进脱模工艺。此外，在质量控制过程中可以进行常规的可靠性监控(如C-SAM, HAST)，以消除客户应用中的这种故障模式。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A Study of Bonding Pad Corrosion Caused by Contamination

This paper introduces a typical corrosion phenomenon of the Integrated Circuits. A three-terminal adjustable shunt regulator outputted abnormal voltage on a PCBA because its Vref pin was open. Bonding pad corrosion was confirmed by SEM&EDX analysis. The pad was electrical open to the surrounding schematic. After a whole investigation, several lots of wafers were confirmed to be contaminated by silicone oil which was introduced during the demolding process. Delamination occurred between the molding compound and die. Plating solution which contained chlorine and sulphur percolated into package during Tin Plating.Supplier of the regulator was recommended to improve the demolding process. Besides, routine reliability monitoring(such as C-SAM, HAST) can be executed in quality control process to eliminate this failure mode in customer’s application.

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来源期刊

2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA)

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