一种用于200V单片GaN功率集成电路的具有dVs/dt抗噪增强结构的高速移电平器

Yifei Zheng, Qing Yuan, Deyuan Song, Yutao Ying, Jing Zhu, Weifeng Sun, Long Zhang, Sheng Li, Denggui Wang, Jianjun Zhou, Sen Zhang, Nailong He
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引用次数: 0

摘要

单片集成已被证明是最小化GaN功率IC中寄生效应的理想解决方案。尽管如此,目前用于功率IC的商业化GaN工艺远不成熟,只有n型hemt可用。因此,高压电平转换器很难实现高速。本工作实现了一种用于GaN IC的电平移位器,在不需要复杂的信号处理电路的情况下,实现了小的响应时间和高的$\ mathm {d}V_ \ mathm {S}}/\text{dt}$抗扰性,从而将延迟和导通损耗降至最低。采用$1\mu\ mathm {m}$ GaN-on-Silicon工艺制作了该电路,并进行了测量结果验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A High-Speed Level Shifter with dVs/dt Noise Immunity Enhancement Structure for 200V Monolithic GaN Power IC
Monolithic integration has been demonstrated to be an ideal solution to minimize the parasitics in GaN power IC. Nonetheless, the current commercially GaN process for power IC is far less mature and only n-type HEMTs are available. Therefore, it is difficult for high voltage level shifters to achieve high speed. This work implements a level shifter for GaN IC to achieve both small response time and high $\mathrm{d}V_{\mathrm{S}}/\text{dt}$ noise immunity without complicated signal processing circuits, thus delay and conduction loss will be minimized. The proposed circuit was fabricated in a $1\mu\mathrm{m}$ GaN-on-Silicon process and measured results were performed to verify the characteristics.
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