{"title":"包对包SMT返工技术","authors":"W. Yuchuan, Chen Qiang","doi":"10.1109/ICEPT.2015.7236548","DOIUrl":null,"url":null,"abstract":"While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity, and seems likely to be implemented in other types of electronic assemblies. In order to improve the SMT rework yield for PoP devices, rework process and reliability study was undertaken. The first goal of this study was to establish the process guideline for PoP SMT rework. The second goal of this study was to assess the reliability of reworked package.","PeriodicalId":415934,"journal":{"name":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Package on Package SMT rework technology\",\"authors\":\"W. Yuchuan, Chen Qiang\",\"doi\":\"10.1109/ICEPT.2015.7236548\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity, and seems likely to be implemented in other types of electronic assemblies. In order to improve the SMT rework yield for PoP devices, rework process and reliability study was undertaken. The first goal of this study was to establish the process guideline for PoP SMT rework. The second goal of this study was to assess the reliability of reworked package.\",\"PeriodicalId\":415934,\"journal\":{\"name\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-09-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 16th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2015.7236548\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 16th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2015.7236548","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity, and seems likely to be implemented in other types of electronic assemblies. In order to improve the SMT rework yield for PoP devices, rework process and reliability study was undertaken. The first goal of this study was to establish the process guideline for PoP SMT rework. The second goal of this study was to assess the reliability of reworked package.
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