金碰撞用喷泉镀杯溶液流动的模拟与优化

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298703

T. Hu, Shuidi Wang, Haining Wang, Jian Cai, Songliang Jia

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引用次数: 1

摘要

在清华大学微电子研究所设计并制作了一种喷泉镀杯。本文介绍了利用计算流体力学(CFD)工具对杯内溶液流动进行模拟和优化的方法。介绍了镀杯的结构，并以扩散器的位置、厚度、孔尺寸和入口流速作为模拟参数。根据模拟结果，在6英寸晶圆上制备了公差为/spl plusmn/2.5 /spl mu/m的Au凸点。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Simulation and optimization of solution flow in fountain-plating cup for Au bumping

A fountain-plating cup is designed and fabricated in IMETU (Institute of Microelectronics, Tsinghua University). The simulation and optimization of solution flow in the cup by computational fluid dynamics (CFD) tool have been introduced in this paper. The structure of the plating cup is presented and the position, the thickness and the hole size of the diffuser and the velocity of flow at entrance are used as the parameters for simulation. With the results of the simulation, Au bumps with tolerance in /spl plusmn/2.5 /spl mu/m on a 6 inch wafer have been fabricated.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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