通过拉盖尔表示的VLSI电路互连的模型阶数降低

M. Telescu, N. Tanguy, P. Bréhonnet, P. Vilbé, Léon-Claude, Calvez, Fabrice Huret
{"title":"通过拉盖尔表示的VLSI电路互连的模型阶数降低","authors":"M. Telescu, N. Tanguy, P. Bréhonnet, P. Vilbé, Léon-Claude, Calvez, Fabrice Huret","doi":"10.1109/SPI.2005.1500914","DOIUrl":null,"url":null,"abstract":"The VLSI (very large scale integration) industry has the tendency to decrease circuit size, increase speed, assuring ever lower energy consumption and ever higher integration density of analogical components accompanied by digital blocks. With this tendency circuit designers are faced with a new challenge: the analysis and modeling of logical and analogical signals propagating between two circuit points. The search for high speed applications makes the effects of interconnects, usually neglected in the past, an important issue; noise, delay, distortion, reflections and cross talk are just some of these effects. High integration density, miniaturization, high working frequencies are three great factors which prevent interconnects to be considered small independent circuits. Thus, simulation becomes a rather difficult task. Still, wouldn't it be possible to replace complete interconnect equivalent circuits by simpler and more flexible models. Our new model-order reduction technique is mainly based on the use of the Laguerre representation and a simple operator used to generate an approximation base.","PeriodicalId":182291,"journal":{"name":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Model-order reduction of VLSI circuit interconnects via a Laguerre representation\",\"authors\":\"M. Telescu, N. Tanguy, P. Bréhonnet, P. Vilbé, Léon-Claude, Calvez, Fabrice Huret\",\"doi\":\"10.1109/SPI.2005.1500914\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The VLSI (very large scale integration) industry has the tendency to decrease circuit size, increase speed, assuring ever lower energy consumption and ever higher integration density of analogical components accompanied by digital blocks. With this tendency circuit designers are faced with a new challenge: the analysis and modeling of logical and analogical signals propagating between two circuit points. The search for high speed applications makes the effects of interconnects, usually neglected in the past, an important issue; noise, delay, distortion, reflections and cross talk are just some of these effects. High integration density, miniaturization, high working frequencies are three great factors which prevent interconnects to be considered small independent circuits. Thus, simulation becomes a rather difficult task. Still, wouldn't it be possible to replace complete interconnect equivalent circuits by simpler and more flexible models. Our new model-order reduction technique is mainly based on the use of the Laguerre representation and a simple operator used to generate an approximation base.\",\"PeriodicalId\":182291,\"journal\":{\"name\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"volume\":\"96 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-05-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2005.1500914\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 9th IEEE Workshop on Signal Propagation on Interconnects, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2005.1500914","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

VLSI(超大规模集成电路)行业的趋势是减小电路尺寸,提高速度,确保更低的能耗和更高的模拟组件集成密度伴随着数字块。在这种趋势下,电路设计人员面临着一个新的挑战:在两个电路点之间传播的逻辑和模拟信号的分析和建模。对高速应用的探索使得互连的影响成为一个重要的问题,而互连在过去通常被忽视;噪音,延迟,失真,反射和串音只是这些影响的一部分。高集成度、小型化和高工作频率是阻碍互连电路被视为小型独立电路的三大因素。因此,模拟成为一项相当困难的任务。不过,用更简单、更灵活的模型来取代完整的互连等效电路,难道不可能吗?我们的新模型阶约简技术主要基于使用拉盖尔表示和一个简单的算子来生成一个近似基。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Model-order reduction of VLSI circuit interconnects via a Laguerre representation
The VLSI (very large scale integration) industry has the tendency to decrease circuit size, increase speed, assuring ever lower energy consumption and ever higher integration density of analogical components accompanied by digital blocks. With this tendency circuit designers are faced with a new challenge: the analysis and modeling of logical and analogical signals propagating between two circuit points. The search for high speed applications makes the effects of interconnects, usually neglected in the past, an important issue; noise, delay, distortion, reflections and cross talk are just some of these effects. High integration density, miniaturization, high working frequencies are three great factors which prevent interconnects to be considered small independent circuits. Thus, simulation becomes a rather difficult task. Still, wouldn't it be possible to replace complete interconnect equivalent circuits by simpler and more flexible models. Our new model-order reduction technique is mainly based on the use of the Laguerre representation and a simple operator used to generate an approximation base.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信