耦合微带线电磁干扰的低频SPICE模型

Proceedings of IEEE Symposium on Electromagnetic Compatibility Pub Date : 1994-08-22 DOI:10.1109/ISEMC.1994.385662

I. Wuyts, D. De Zutter

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引用次数: 1

摘要

推导了一个低频电路模型(通常是SPICE模型)来计算低频均匀平面波入射在多层微带结构上所引起的电压和电流。本文提出了一种新的分析方法，它是基于低频级数展开，而不是基于麦克斯韦方程组的直接积分

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Low-frequency SPICE model for EMC-disturbances on coupled microstrip lines

A low-frequency circuit model (typically a SPICE model) is derived to calculate the voltages and currents caused by the incidence of a low-frequency uniform plane wave on a multilayered microstrip structure. A new analysis method is demonstrated, based on a low-frequency series expansion rather than on the direct integration of Maxwell's equations.<>

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Proceedings of IEEE Symposium on Electromagnetic Compatibility

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