{"title":"厚阻性薄膜结构特性与噪声特性的关系","authors":"I. Stanimirović, M. Jevtic, Z. Stanimirović","doi":"10.1109/ICMEL.2000.838745","DOIUrl":null,"url":null,"abstract":"A relationship between structural characteristics and noise properties of thick resistive films using noise reduced mobility is presented, proving that noise index measurements can be used as an indicator in thick-film quality and reliability diagnostics. In addition, this analysis can serve as a basis for development of a new diagnostic method for thick resistive films based on noise index measurements.","PeriodicalId":215956,"journal":{"name":"2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A relationship between structural characteristics and noise properties of thick resistive films\",\"authors\":\"I. Stanimirović, M. Jevtic, Z. Stanimirović\",\"doi\":\"10.1109/ICMEL.2000.838745\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A relationship between structural characteristics and noise properties of thick resistive films using noise reduced mobility is presented, proving that noise index measurements can be used as an indicator in thick-film quality and reliability diagnostics. In addition, this analysis can serve as a basis for development of a new diagnostic method for thick resistive films based on noise index measurements.\",\"PeriodicalId\":215956,\"journal\":{\"name\":\"2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-05-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMEL.2000.838745\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 22nd International Conference on Microelectronics. Proceedings (Cat. No.00TH8400)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMEL.2000.838745","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A relationship between structural characteristics and noise properties of thick resistive films
A relationship between structural characteristics and noise properties of thick resistive films using noise reduced mobility is presented, proving that noise index measurements can be used as an indicator in thick-film quality and reliability diagnostics. In addition, this analysis can serve as a basis for development of a new diagnostic method for thick resistive films based on noise index measurements.