14nm FinFET技术下CMOS逆变链环振荡器有效电容的定量模型及改进

S. Mun, J. Cho, B. Zhu, P. Agnihotri, C. Y. Wong, T. Lee, V. Mahajan, B. Liu, Y. Shi, W. Hong, J. Ciavatti, J. G. Lee, S. Samavedam, D. K. Sohn
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引用次数: 2

摘要

采用先进的替代金属栅极(RMG)技术,成功地提取了14nm节点FinFET 3D结构中CMOS环形振荡器(R/O)逆变链的有效总电容Ceff的定量模型,该模型使用了组成R/O的所有单位电容组件,如逆变器、扇出(F/O) MOSCAP和金属路由。所提取的Ceff模型与R/O中实测的Si Ceff非常匹配,验证了模型的有效性。本文利用通道电容(Cgc)、重叠电容(Cov)、结电容(Cj)和金属线电容(Cwire)等单个晶体管电容分量,考虑R/O布局及其运行机制,给出了一个简洁清晰的逆变器R/O链Ceff定量模型,这是以往从未有过的报道。利用Si数据和仿真,将Cov分解为栅极-接触电容(Cmol)、EPI源漏极-鳍顶栅极电容(S/D)、EPI S/D -鳍侧壁栅极电容(Cfb)和本特性栅极- S/D重叠电容(Cdo)。通过Si验证提取Cgc, Cmol, Cj, Cwire, Cft, Cfb和Cdo的所有电容器组件对Ceff的贡献。本文还提供了在不降低直流性能的情况下降低Cov的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Quantitative model of CMOS inverter chain ring oscillator's effective capacitance and its improvements in 14nm FinFET technology
The quantitative model of effective total capacitance, Ceff, of a CMOS ring oscillator (R/O) inverter chain in a 14nm node FinFET 3D structure using advanced Replacement Metal Gate (RMG) is successfully extracted using all the unit capacitance components comprising the R/O, such as inverter, fan-out (F/O) MOSCAP, and metal routing. The extracted Ceff model is well validated by perfect matching to the measured Si Ceff in the R/O. This paper provides a concise and clear Ceff quantitative model of inverter R/O chain using individual transistor capacitance components such as channel capacitance (Cgc), overlap capacitance (Cov), junction capacitance (Cj) and metal wire capacitance (Cwire) considering the R/O layout and its operation mechanism, which has never been reported before. Furthermore, Cov is decomposed with the gate to contact capacitance (Cmol), EPI source-drain (S/D) to gate on Fin top (Cft), EPI S/D to gate on Fin sidewall (Cfb) and intrinsic gate to S/D overlap capacitance (Cdo) with Si data and simulation. Contribution to Ceff by all the capacitor components from Cgc, Cmol, Cj, Cwire, Cft, Cfb and Cdo is extracted with Si validation. Cov reduction without DC performance degradation is also provided in this paper.
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