40 GHz热通倒装芯片互连

IEEE MTT-S International Microwave Symposium Digest, 2003 Pub Date : 2003-06-08 DOI:10.1109/MWSYM.2003.1212576

F. Schmuckle, A. Jentzsch, C. Gassler, P. Marschall, D. Geiger, W. Heinrich

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引用次数: 17

摘要

提出了一种用于40ghz频段的热通倒装芯片互连方法。芯片输入输出单元包括晶圆上探测垫，尺寸最小。优化后的设计具有10 GHz带宽和-40 dB隔离的优异性能。这证明了热通方法在毫米波应用中的潜力。

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40 GHz hot-via flip-chip interconnects

A hot-via flip-chip interconnect for the 40 GHz band is presented. The chip in-out cell includes on-wafer probing pads and is minimized with regard to size. An optimized design shows excellent performance with 10 GHz of bandwidth and -40 dB isolation. This demonstrates the potential of the hot-via approach in mm-wave applications.

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来源期刊

IEEE MTT-S International Microwave Symposium Digest, 2003

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