{"title":"提高硅片化学机械抛光效率的研究","authors":"V. Khmelev, A. Shalunov, E.S. Smerdina","doi":"10.1109/SIBEDM.2006.231297","DOIUrl":null,"url":null,"abstract":"The present paper is concerned with the reasons of increasing the efficiency of one of the basic processes in manufacturing of semiconductors -chemical-mechanical polishing (CMP). The promising researches-and-experiments based way of the above problem solution by the application of ultrasonic spraying of a polishing liquid is offered. The paper reports the design which allows to embed the ultrasonic apparatus in the present equipment for CMP process","PeriodicalId":151587,"journal":{"name":"International Workshops and Tutorials on Electron Devices and Materials","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Increasing Efficiency of a Chemical-Mechanical Polishing of the Silicon Wafer\",\"authors\":\"V. Khmelev, A. Shalunov, E.S. Smerdina\",\"doi\":\"10.1109/SIBEDM.2006.231297\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The present paper is concerned with the reasons of increasing the efficiency of one of the basic processes in manufacturing of semiconductors -chemical-mechanical polishing (CMP). The promising researches-and-experiments based way of the above problem solution by the application of ultrasonic spraying of a polishing liquid is offered. The paper reports the design which allows to embed the ultrasonic apparatus in the present equipment for CMP process\",\"PeriodicalId\":151587,\"journal\":{\"name\":\"International Workshops and Tutorials on Electron Devices and Materials\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Workshops and Tutorials on Electron Devices and Materials\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SIBEDM.2006.231297\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Workshops and Tutorials on Electron Devices and Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIBEDM.2006.231297","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Increasing Efficiency of a Chemical-Mechanical Polishing of the Silicon Wafer
The present paper is concerned with the reasons of increasing the efficiency of one of the basic processes in manufacturing of semiconductors -chemical-mechanical polishing (CMP). The promising researches-and-experiments based way of the above problem solution by the application of ultrasonic spraying of a polishing liquid is offered. The paper reports the design which allows to embed the ultrasonic apparatus in the present equipment for CMP process
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