{"title":"化学法制备NiP/PdP/Au膜的Ni扩散行为及键合性","authors":"Akifumi Kurachi, Katsuyuki Tsuchida, T. Kawai","doi":"10.1109/ISSM51728.2020.9377511","DOIUrl":null,"url":null,"abstract":"The Ni diffusion behavior of electroless NiP/PdP/Au film was investigated using Auger electron spectroscopy in this study. The diffusion coefficient of Ni in PdP was estimated from concentration profile by Einstein-Smoluchowski equation and Boltzman-Matano method. The obtained value was 3.5 ~4.7⨯10–20 m2s-1at 553 K. Furthermore, the bondability of the NiP/PdP/Au film before and after heat treatment was also studies to clarify the bonding reliability of the film of various thickness. Thicker NiP/PdP/Au film condition achieved high bonding reliability at least under the condition of this study.","PeriodicalId":270309,"journal":{"name":"2020 International Symposium on Semiconductor Manufacturing (ISSM)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Ni Diffusion Behavior and Bondability of Electroless NiP/PdP/Au Film\",\"authors\":\"Akifumi Kurachi, Katsuyuki Tsuchida, T. Kawai\",\"doi\":\"10.1109/ISSM51728.2020.9377511\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Ni diffusion behavior of electroless NiP/PdP/Au film was investigated using Auger electron spectroscopy in this study. The diffusion coefficient of Ni in PdP was estimated from concentration profile by Einstein-Smoluchowski equation and Boltzman-Matano method. The obtained value was 3.5 ~4.7⨯10–20 m2s-1at 553 K. Furthermore, the bondability of the NiP/PdP/Au film before and after heat treatment was also studies to clarify the bonding reliability of the film of various thickness. Thicker NiP/PdP/Au film condition achieved high bonding reliability at least under the condition of this study.\",\"PeriodicalId\":270309,\"journal\":{\"name\":\"2020 International Symposium on Semiconductor Manufacturing (ISSM)\",\"volume\":\"17 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 International Symposium on Semiconductor Manufacturing (ISSM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM51728.2020.9377511\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Symposium on Semiconductor Manufacturing (ISSM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM51728.2020.9377511","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Ni Diffusion Behavior and Bondability of Electroless NiP/PdP/Au Film
The Ni diffusion behavior of electroless NiP/PdP/Au film was investigated using Auger electron spectroscopy in this study. The diffusion coefficient of Ni in PdP was estimated from concentration profile by Einstein-Smoluchowski equation and Boltzman-Matano method. The obtained value was 3.5 ~4.7⨯10–20 m2s-1at 553 K. Furthermore, the bondability of the NiP/PdP/Au film before and after heat treatment was also studies to clarify the bonding reliability of the film of various thickness. Thicker NiP/PdP/Au film condition achieved high bonding reliability at least under the condition of this study.
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