用于未来微处理器高强度热负荷耗散的紧凑和高热液压高效风冷闭环热虹吸冷却系统

Enzo M. Minazzo, Gautier Rouaze, J. Marcinichen, J. R. Thome, L. Zhang
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引用次数: 2

摘要

设计了一种非常紧凑的风冷循环热虹吸冷却系统(LTS),并对其进行了原型化和测试,用于微处理器冷却应用。它是专门为2U服务器设计的,热负荷高达400w,占地面积为40mm / 40mm。采用低压、低GWP的工质R1233zd(E)。测试在两种环境温度(22°C和40°C)下进行,包括最佳充电确定以及最佳充电下的广泛测试。性能比(简单定义为热负荷除以风扇功耗)在最大热负荷为400w时大于30。实验结果还用于验证JJ Cooling Innovation为设计LTS而开发的内部专有求解器,并将展示结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Compact and Highly Thermal-Hydraulic Efficient Air-Cooled Closed Loop Thermosyphon Cooling System for High Intense Heat Load Dissipation of Future Microprocessors
A very compact air-cooled loop thermosyphon cooling system (LTS) was designed, prototyped and tested for microprocessor cooling application. It was designed specifically for 2U servers and heat loads up to 400 W in a footprint area of 40 mm per 40 mm. The low pressure and low GWP working fluid R1233zd(E) was used. Tests were done for two ambient temperatures (22 °C and 40 °C) and included optimal charge determination as well as extensive tests at optimal charge. Values of performance ratio, simply defined as heat load divided by fan power consumption, higher than 30 were observed for the maximum heat load of 400 W. The experimental results were also used to validate JJ Cooling Innovation’s inhouse proprietary solver developed to design the LTS and results will be presented.
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