{"title":"展示了6h碳化硅在功率器件中的潜力","authors":"J. Palmour, J. Edmond, C. Carter","doi":"10.1109/DRC.1993.1009604","DOIUrl":null,"url":null,"abstract":"Summary form only given. Discusses the first vertical UMOS power MOSFETs ever reported in SiC, shows the highest gain 6H-SiC BJTs (bipolar junction transistors) and thyristors ever reported, and demonstrate the high-temperature operation of these devices. Vertical power MOSFETs fabricated in 6H-SiC with a UMOS design have specific on-resistances as low as 38 m Omega -cm/sup 2/ at a gate bias of +12 V. These devices can have current densities as high as 190 A/cm/sup 2/ (0.32 A/cm of gate periphery) and can dissipate a maximum power density of 5.4 kW/cm/sup 2/. SiC BJTs have been demonstrated up to 400 degrees C. The device structure used a reactive ion etched emitter with sintered Ni contacts to both the emitter and collector, and Al/Ti alloy contacts to the base. Four-layer structures have also been demonstrated in 6H-SiC, with p-n-p-n thyristors showing 100 V operation. >","PeriodicalId":310841,"journal":{"name":"51st Annual Device Research Conference","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Demonstrating the potential of 6h-silicon carbide for power devices\",\"authors\":\"J. Palmour, J. Edmond, C. Carter\",\"doi\":\"10.1109/DRC.1993.1009604\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. Discusses the first vertical UMOS power MOSFETs ever reported in SiC, shows the highest gain 6H-SiC BJTs (bipolar junction transistors) and thyristors ever reported, and demonstrate the high-temperature operation of these devices. Vertical power MOSFETs fabricated in 6H-SiC with a UMOS design have specific on-resistances as low as 38 m Omega -cm/sup 2/ at a gate bias of +12 V. These devices can have current densities as high as 190 A/cm/sup 2/ (0.32 A/cm of gate periphery) and can dissipate a maximum power density of 5.4 kW/cm/sup 2/. SiC BJTs have been demonstrated up to 400 degrees C. The device structure used a reactive ion etched emitter with sintered Ni contacts to both the emitter and collector, and Al/Ti alloy contacts to the base. Four-layer structures have also been demonstrated in 6H-SiC, with p-n-p-n thyristors showing 100 V operation. >\",\"PeriodicalId\":310841,\"journal\":{\"name\":\"51st Annual Device Research Conference\",\"volume\":\"11 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"51st Annual Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DRC.1993.1009604\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"51st Annual Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC.1993.1009604","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Demonstrating the potential of 6h-silicon carbide for power devices
Summary form only given. Discusses the first vertical UMOS power MOSFETs ever reported in SiC, shows the highest gain 6H-SiC BJTs (bipolar junction transistors) and thyristors ever reported, and demonstrate the high-temperature operation of these devices. Vertical power MOSFETs fabricated in 6H-SiC with a UMOS design have specific on-resistances as low as 38 m Omega -cm/sup 2/ at a gate bias of +12 V. These devices can have current densities as high as 190 A/cm/sup 2/ (0.32 A/cm of gate periphery) and can dissipate a maximum power density of 5.4 kW/cm/sup 2/. SiC BJTs have been demonstrated up to 400 degrees C. The device structure used a reactive ion etched emitter with sintered Ni contacts to both the emitter and collector, and Al/Ti alloy contacts to the base. Four-layer structures have also been demonstrated in 6H-SiC, with p-n-p-n thyristors showing 100 V operation. >