10+ Gb/s 90nm CMOS串行链路演示CBGA封装

Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571) Pub Date : 2004-11-22 DOI:10.1109/CICC.2004.1358725

Sergey V. Rylov, S. Reynolds, D. Storaska, Brian A. Floyd, Mohit Kapur, Thomas Zwick, Sudhir M. Gowda, M. Sorna

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引用次数: 0

摘要

我们报道了一个90纳米CMOS的10+ Gb/s串行链路演示芯片。它包括一个带8个抽头前馈均衡器的全速率4:1 MUX，一个带可编程峰值前置放大器的半速率1:4 DEMUX和一个并口接口。该芯片采用CBGA封装，并在所有引脚上使用ESD器件。测得单机发射和接收机的最大速度分别为11.7 Gb/s和13.3 Gb/s，最大背靠背运行速度(发射+接收机)为11.4 Gb/s。

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10+ Gb/s 90nm CMOS serial link demo in CBGA package

We report a 10+ Gb/s serial link demo chip in 90-nm CMOS. It consists of a full-rate 4:1 MUX with 8-tap feed-forward equalizer, a half-rate 1:4 DEMUX with programmable peaking pre-amplifier, and a parallel port interface. The chip is housed in CBGA package and uses ESD devices on all pins. The measured maximum speed of stand-alone transmitter and receiver was 11.7 Gb/s and 13.3 Gb/s respectively, and maximum back-to-back operation speed (transmitter+receiver) was 11.4 Gb/s.

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Proceedings of the IEEE 2004 Custom Integrated Circuits Conference (IEEE Cat. No.04CH37571)

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