D. Plant, A. Shang, M. R. Otazo, B. Robertson, H. S. Hinton
{"title":"用于光学背板的FET-SEED智能像素收发器阵列的设计与表征","authors":"D. Plant, A. Shang, M. R. Otazo, B. Robertson, H. S. Hinton","doi":"10.1109/LEOSST.1994.700452","DOIUrl":null,"url":null,"abstract":"Currently, we are developing the optical, optoelectronic, and optomechanical technology required to demonstrate a representative portion of a free-space optical backplane. Such a backplane can be created with two dimensional arrays of passive free-space Parallel Optical Channels (POCs) to optically interconnect the systems electronic Printed Circuit Boards and/or Multichip Modules (MCMs). Specific demonstration projects include the optical interconnection of PCBs via these passive optical channels using FET-SEED Smart Pixel transceivers. The first demonstrator will show the optical interconmtion of a 4 x 4 FET-SEED transmitter array mounted on one PCB to an opposing 4 x 4 FET-SEED receiver array mounted on an adjacent PCB.","PeriodicalId":379594,"journal":{"name":"Proceedings of IEE/LEOS Summer Topical Meetings: Integrated Optoelectronics","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Design And Characterization Of FET-SEED Smart Pixel Transceiver Arrays For Optical Backplanes\",\"authors\":\"D. Plant, A. Shang, M. R. Otazo, B. Robertson, H. S. Hinton\",\"doi\":\"10.1109/LEOSST.1994.700452\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Currently, we are developing the optical, optoelectronic, and optomechanical technology required to demonstrate a representative portion of a free-space optical backplane. Such a backplane can be created with two dimensional arrays of passive free-space Parallel Optical Channels (POCs) to optically interconnect the systems electronic Printed Circuit Boards and/or Multichip Modules (MCMs). Specific demonstration projects include the optical interconnection of PCBs via these passive optical channels using FET-SEED Smart Pixel transceivers. The first demonstrator will show the optical interconmtion of a 4 x 4 FET-SEED transmitter array mounted on one PCB to an opposing 4 x 4 FET-SEED receiver array mounted on an adjacent PCB.\",\"PeriodicalId\":379594,\"journal\":{\"name\":\"Proceedings of IEE/LEOS Summer Topical Meetings: Integrated Optoelectronics\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEE/LEOS Summer Topical Meetings: Integrated Optoelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/LEOSST.1994.700452\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEE/LEOS Summer Topical Meetings: Integrated Optoelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOSST.1994.700452","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design And Characterization Of FET-SEED Smart Pixel Transceiver Arrays For Optical Backplanes
Currently, we are developing the optical, optoelectronic, and optomechanical technology required to demonstrate a representative portion of a free-space optical backplane. Such a backplane can be created with two dimensional arrays of passive free-space Parallel Optical Channels (POCs) to optically interconnect the systems electronic Printed Circuit Boards and/or Multichip Modules (MCMs). Specific demonstration projects include the optical interconnection of PCBs via these passive optical channels using FET-SEED Smart Pixel transceivers. The first demonstrator will show the optical interconmtion of a 4 x 4 FET-SEED transmitter array mounted on one PCB to an opposing 4 x 4 FET-SEED receiver array mounted on an adjacent PCB.
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