一个解释mosfet和rram随机电报噪声复杂性的统一框架

Sara Vecchi, P. Pavan, F. Puglisi
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引用次数: 0

摘要

众所周知,在纳米级器件中实施$\text{high}-\kappa$电介质(例如$\text{HfO}_{2})$是不可避免的,以应对市场所需的器件缩放。然而,由于与$\text{SiO}_{2}$相比缺陷密度更高,氧化铪表现出更强和更复杂的随机电报噪声(RTN),即超薄氧化物中最相关的缺陷相关可靠性问题之一。但是,根据器件类型的不同,$\text{HfO}_{2}$可以具有不同的缺陷密度,从而导致不同的RTN信号。特别是,在电阻随机存取存储器(RRAM)器件中,RTN经常出现,但表现出高度的复杂性(例如,多电平,异常,临时RTN)和不稳定性[3],[4]阻碍了其表征。相反,在mosfet中,RTN的发生率很小,如果检测到,它通常表现出简单的行为(即2电平信号)。在这项工作中,我们充分分析了不同设备中的这种现象,提供了一个统一的基于物理的框架,这也得到了实验的证实。这项研究的结果对于新兴的基于rtn的应用(如真随机数发生器(trng))的新器件和电路的设计至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Unified Framework to Explain Random Telegraph Noise Complexity in MOSFETs and RRAMs
As well known, the implementation of $\text{high}-\kappa$ dielectrics (e.g., $\text{HfO}_{2})$ in nanoscale devices is unavoidable to cope with the device scaling required by the market. Nevertheless, due to the higher defect density compared to $\text{SiO}_{2}$, hafnium oxide exhibits stronger and more complex Random Telegraph Noise (RTN), namely one of the most relevant defect-related reliability issues in ultra-thin oxides. However, depending on the device type, $\text{HfO}_{2}$ can be characterized by different defect density and therefore leading to a different RTN signals. In particular, in Resistive Random Access Memory (RRAM) devices RTN arises very often but shows a high degree of complexity (e.g., multilevel, anomalous, temporary RTN) and instabilities [3], [4] which hinders its characterization. Conversely, in MOSFETs RTN has a small occurrence and it typically exhibits a simple behavior (i.e., 2-level signal) if detected. In this work, we fully analyze such phenomena in different devices providing a unified and physics-based framework which is also confirmed by experiments. The results of this study will be crucial for the design of new devices and circuits for emerging RTN-based applications, such as True Random Number Generators (TRNGs).
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