软错误效应容忍时间自我投票检查:能量与弹性权衡

Faris S. Alghareb, Mingjie Lin, R. Demara
{"title":"软错误效应容忍时间自我投票检查:能量与弹性权衡","authors":"Faris S. Alghareb, Mingjie Lin, R. Demara","doi":"10.1109/ISVLSI.2016.19","DOIUrl":null,"url":null,"abstract":"Achieving high reliability against transient faults poses significant challenges due to the trends of technology and voltage scaling. Thus, numerous soft error mitigation techniques have been proposed for masking Soft Error Rate (SER) in logic circuits. However, most soft error suppression approaches have significant overheads in terms of area, power consumption, and speed performance degradation. Herein, we propose two circuit-level techniques, namely Temporal Self-Voting Logic (TSVL) and Hybrid Spatial and Temporal Redundancy Double-Error Correction (HSTR-DEC), to prevent the effects of soft errors in logic circuits, occurring due to Single Event Upset (SEU) or Single Event Transient (SET). TSVL and HSTR-DEC circuits can be utilized to improve the reliability of a logic path with minimal impact on circuit delay while achieving a complete and cost-effective SEU handling as compared to traditional spatial or temporal redundancy approach. The primary contribution of the TSVL approach is that it eliminates error masking from the critical datapath, thus, area and energy overheads are significantly reduced. A transient gate-level fault injection and analysis is used to evaluate the capability of soft errors suppression of the proposed hardening approach. Experimental results indicate that TSVL can cover soft errors, on average, roughly by 99% while realizing an amelioration of 22.02% and 2.15% for area and speed degradation as compared to the previous Self-Voting DMR approach. Meanwhile, HSTRDEC approach realizes a complete coverage for single and double SEUs while incurring comparable area and delay overheads as compared to the prior hybrid redundancy approach.","PeriodicalId":140647,"journal":{"name":"2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Soft Error Effect Tolerant Temporal Self-Voting Checkers: Energy vs. Resilience Tradeoffs\",\"authors\":\"Faris S. Alghareb, Mingjie Lin, R. Demara\",\"doi\":\"10.1109/ISVLSI.2016.19\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Achieving high reliability against transient faults poses significant challenges due to the trends of technology and voltage scaling. Thus, numerous soft error mitigation techniques have been proposed for masking Soft Error Rate (SER) in logic circuits. However, most soft error suppression approaches have significant overheads in terms of area, power consumption, and speed performance degradation. Herein, we propose two circuit-level techniques, namely Temporal Self-Voting Logic (TSVL) and Hybrid Spatial and Temporal Redundancy Double-Error Correction (HSTR-DEC), to prevent the effects of soft errors in logic circuits, occurring due to Single Event Upset (SEU) or Single Event Transient (SET). TSVL and HSTR-DEC circuits can be utilized to improve the reliability of a logic path with minimal impact on circuit delay while achieving a complete and cost-effective SEU handling as compared to traditional spatial or temporal redundancy approach. The primary contribution of the TSVL approach is that it eliminates error masking from the critical datapath, thus, area and energy overheads are significantly reduced. A transient gate-level fault injection and analysis is used to evaluate the capability of soft errors suppression of the proposed hardening approach. Experimental results indicate that TSVL can cover soft errors, on average, roughly by 99% while realizing an amelioration of 22.02% and 2.15% for area and speed degradation as compared to the previous Self-Voting DMR approach. Meanwhile, HSTRDEC approach realizes a complete coverage for single and double SEUs while incurring comparable area and delay overheads as compared to the prior hybrid redundancy approach.\",\"PeriodicalId\":140647,\"journal\":{\"name\":\"2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)\",\"volume\":\"7 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISVLSI.2016.19\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISVLSI.2016.19","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

由于技术和电压缩放的发展趋势,实现对暂态故障的高可靠性提出了重大挑战。因此,已经提出了许多软错误缓解技术来掩盖逻辑电路中的软错误率(SER)。然而,大多数软错误抑制方法在面积、功耗和速度性能下降方面都有很大的开销。在此,我们提出了两种电路级技术,即时间自投票逻辑(TSVL)和混合时空冗余双错误校正(HSTR-DEC),以防止逻辑电路中由于单事件扰动(SEU)或单事件暂态(SET)而产生的软错误的影响。与传统的空间或时间冗余方法相比,TSVL和HSTR-DEC电路可用于提高逻辑路径的可靠性,同时对电路延迟的影响最小,同时实现完整且经济高效的SEU处理。TSVL方法的主要贡献是它消除了关键数据路径的错误屏蔽,因此,面积和能量开销显着降低。采用瞬态门级故障注入和分析来评估所提出的强化方法的软误差抑制能力。实验结果表明,与之前的自投票DMR方法相比,TSVL平均可以覆盖大约99%的软误差,同时在面积和速度退化方面实现了22.02%和2.15%的改善。同时,与之前的混合冗余方法相比,HSTRDEC方法实现了单seu和双seu的完全覆盖,同时产生了相当的面积和延迟开销。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Soft Error Effect Tolerant Temporal Self-Voting Checkers: Energy vs. Resilience Tradeoffs
Achieving high reliability against transient faults poses significant challenges due to the trends of technology and voltage scaling. Thus, numerous soft error mitigation techniques have been proposed for masking Soft Error Rate (SER) in logic circuits. However, most soft error suppression approaches have significant overheads in terms of area, power consumption, and speed performance degradation. Herein, we propose two circuit-level techniques, namely Temporal Self-Voting Logic (TSVL) and Hybrid Spatial and Temporal Redundancy Double-Error Correction (HSTR-DEC), to prevent the effects of soft errors in logic circuits, occurring due to Single Event Upset (SEU) or Single Event Transient (SET). TSVL and HSTR-DEC circuits can be utilized to improve the reliability of a logic path with minimal impact on circuit delay while achieving a complete and cost-effective SEU handling as compared to traditional spatial or temporal redundancy approach. The primary contribution of the TSVL approach is that it eliminates error masking from the critical datapath, thus, area and energy overheads are significantly reduced. A transient gate-level fault injection and analysis is used to evaluate the capability of soft errors suppression of the proposed hardening approach. Experimental results indicate that TSVL can cover soft errors, on average, roughly by 99% while realizing an amelioration of 22.02% and 2.15% for area and speed degradation as compared to the previous Self-Voting DMR approach. Meanwhile, HSTRDEC approach realizes a complete coverage for single and double SEUs while incurring comparable area and delay overheads as compared to the prior hybrid redundancy approach.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信