65nm及以上节点的USJ形成与表征

J. Borland
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引用次数: 0

摘要

形成超浅结(USJ)的多种新方法正在被研究。6Snm节点基于;1)新的离子注入硬件设计,2)新的簇离子掺杂种类,3)新的零扩散掺杂活化退火设备,4)非注入选择性外延原位掺杂技术。此外,正在开发改进的精确测量和表征技术,以确定电活性掺杂的水平和深度剖面,而不是化学(电非活性)掺杂的水平和剖面。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
USJ formation & characterization for 65nm node and beyond
Multiple new methods of forming ultrashallow junctions (USJ) are being pursued for. 6Snm node based on; I) new ion implantation hardware designs, 2) new cluster ion dopant species, 3) new zero diffusion dopant activation annealing equipment and 4) non-implantation alternative selective epi in-situ doping techniques. Also, improved accurate measurement and characterization techniques to determine the electrically active dopant level and depth : profile as opposed to the chemical (electrically inactive) dopant level and profiles are being developed.
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