末端腐蚀对微通道板性能的影响

A. Stanković, I. Zlatković, R. Nikolov, B. Brindić, D. Pantić
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引用次数: 0

摘要

微通道板(MCP)是一种电子倍增器件,是图像增强器的关键部件。它由数百万个非常薄的导电玻璃通道(直径4-25微米)融合在一起组成。根据电子二次发射的原理,每个通道作为一个独立的电子倍增器起作用。在制造MCP的最后阶段,电极被蒸发到MCP的输入和输出表面上[1]。在输出电极的蒸发过程中,涂层以约2个孔径的深度穿透每个孔,从而导致从MCP孔的末端去除二次发射特征。本文将描述其对增益和空间分辨率的影响。以及沉积层厚度对表面电阻的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Endspoiling on Microchannel Plate Performance
Microchannel plate (MCP) as a key part of image intensifiers is an electron multiplier device. It consists of several million very thin, conductive glass channels (4–25 micrometers in diameter) fused together. Each channel functions as an independent electron multiplier according to the principle of secondary emission of an electron. During the final stage of manufacturing an MCP, an electrode is evaporated onto the input and output surface of the MCP [1]. During evaporation of the output electrode, the coating penetrates each pore by a depth of about 2 pore diameters which leads to removing the secondary emission characteristic from the end of the MCP pore. Its effect on gain and spatial resolution will be depicted in this paper. As well as the influence of deposited layer thickness on surface resistance.
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