MCM-D/ l中的微孔技术需求、挑战和响应

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) Pub Date : 1998-03-15 DOI:10.1109/ISAPM.1998.664434

Weiping Li, R. Tummala

{"title":"MCM-D/ l中的微孔技术需求、挑战和响应","authors":"Weiping Li, R. Tummala","doi":"10.1109/ISAPM.1998.664434","DOIUrl":null,"url":null,"abstract":"This paper discusses the performance and cost needs of high-density wiring substrates and the challenges to the materials and processes of MCM-D/L technology. The approach proposed by the Packaging Research Center (PRC) at Georgia Tech to meet these needs and challenges is presented along with some up-to-date advances in microvia technology. Finally, further research and development planned on microvia technology is presented.","PeriodicalId":354229,"journal":{"name":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Microvia technology in MCM-D/L-need, challenge, and response\",\"authors\":\"Weiping Li, R. Tummala\",\"doi\":\"10.1109/ISAPM.1998.664434\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper discusses the performance and cost needs of high-density wiring substrates and the challenges to the materials and processes of MCM-D/L technology. The approach proposed by the Packaging Research Center (PRC) at Georgia Tech to meet these needs and challenges is presented along with some up-to-date advances in microvia technology. Finally, further research and development planned on microvia technology is presented.\",\"PeriodicalId\":354229,\"journal\":{\"name\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISAPM.1998.664434\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.1998.664434","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本文讨论了高密度布线基板的性能和成本需求，以及MCM-D/L技术对材料和工艺的挑战。佐治亚理工学院包装研究中心(PRC)为满足这些需求和挑战而提出的方法，以及微孔技术的一些最新进展。最后，对微孔技术的进一步研究和发展进行了展望。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Microvia technology in MCM-D/L-need, challenge, and response

This paper discusses the performance and cost needs of high-density wiring substrates and the challenges to the materials and processes of MCM-D/L technology. The approach proposed by the Packaging Research Center (PRC) at Georgia Tech to meet these needs and challenges is presented along with some up-to-date advances in microvia technology. Finally, further research and development planned on microvia technology is presented.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153)

自引率

0.00%

发文量