工艺尺度对标准CMOS工艺制造晶体管射频性能的影响

Han-Su Kim, Chulho Chung, Joohyun Jeong, Seung-Jae Jung, Jinsung Lim, J. Joe, Jaehoon Park, Hyunwoo Lee, G. Jo, Kangwook Park, Jedon D. Kim, Hansu Oh, J. Yoon
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引用次数: 7

摘要

对于栅极长度为35 nm、采用45 nm标准CMOS技术制造的晶体管,NMOS和PMOS的截止频率分别为300 GHz和230 GHz。电流增益(H21)和噪声(闪烁和热)通过缩小技术得到改善。随着技术的进步,功率增益(Gu)增长缓慢,甚至在45纳米处达到饱和。这种饱和功率增益归因于gds(漏极电导)的快速增加。需要额外的努力来减少gds,以便随着缩放不断提高功率增益。优化是实现更好的目标的选择之一。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of technology scaling on RF performance of the transistors fabricated by standard CMOS technology
Cut-off frequency (fT) of 300 GHz and 230 GHz for NMOS and PMOS is demonstrated for transistors with a gate length of 35 nm fabricated by 45 nm standard CMOS technology. Current gain (H21) and noise (flicker and thermal) is improved with scaling down technology. Power gain (Gu) increase is slow down and even saturated at 45 nm as technology advances. Such saturation in power gain is attributed to rapid increase in gds (drain conductance). Additional efforts are required to reduce gds for continuous improvement in power gain with the scaling. Vth optimization can be one of options to achieve better gds.
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