基于砷化镓微芯片的微波开关与放大模块的设计与制作

R. Pengelly, A. Ezzeddine, B. Maoz
{"title":"基于砷化镓微芯片的微波开关与放大模块的设计与制作","authors":"R. Pengelly, A. Ezzeddine, B. Maoz","doi":"10.1109/ESSCIRC.1988.5468372","DOIUrl":null,"url":null,"abstract":"GaAs MMIC technology and circuit design has matured over the last few years to a point where a number of products are now available commercially. Until recently these products have been single bare die or packaged single devices. Subsystem research and development centers have been building multi-chip modules for some time (ref. 1 & 2 for example), but there have been very few examples of such items being commercially available. This paper describes the design of a number of GaAs MMICs and the assembly of these parts into multi-chip modules built specifically as cost-effective products. Specific examples of driven multi-throw switches for EW, communications and test equipment applications are given together with details of amplifier modules containing voltage regulation and temperature compensation.","PeriodicalId":197244,"journal":{"name":"ESSCIRC '88: Fourteenth European Solid-State Circuits Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Design and Production of Microwave Switch and Amplifier Modules Employing GaAs MMICs\",\"authors\":\"R. Pengelly, A. Ezzeddine, B. Maoz\",\"doi\":\"10.1109/ESSCIRC.1988.5468372\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"GaAs MMIC technology and circuit design has matured over the last few years to a point where a number of products are now available commercially. Until recently these products have been single bare die or packaged single devices. Subsystem research and development centers have been building multi-chip modules for some time (ref. 1 & 2 for example), but there have been very few examples of such items being commercially available. This paper describes the design of a number of GaAs MMICs and the assembly of these parts into multi-chip modules built specifically as cost-effective products. Specific examples of driven multi-throw switches for EW, communications and test equipment applications are given together with details of amplifier modules containing voltage regulation and temperature compensation.\",\"PeriodicalId\":197244,\"journal\":{\"name\":\"ESSCIRC '88: Fourteenth European Solid-State Circuits Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1988-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ESSCIRC '88: Fourteenth European Solid-State Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSCIRC.1988.5468372\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC '88: Fourteenth European Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.1988.5468372","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在过去的几年中,GaAs MMIC技术和电路设计已经成熟,许多产品现在已经商业化。直到最近,这些产品都是单裸模或封装的单器件。子系统研究和开发中心已经构建多芯片模块有一段时间了(例如参考文献1和2),但是这种项目在商业上可用的例子很少。本文描述了一些GaAs mmic的设计,以及将这些部件组装成多芯片模块的方法,这些模块是专门为具有成本效益的产品而构建的。给出了用于电子战、通信和测试设备应用的驱动多投开关的具体示例,以及包含电压调节和温度补偿的放大器模块的详细信息。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Design and Production of Microwave Switch and Amplifier Modules Employing GaAs MMICs
GaAs MMIC technology and circuit design has matured over the last few years to a point where a number of products are now available commercially. Until recently these products have been single bare die or packaged single devices. Subsystem research and development centers have been building multi-chip modules for some time (ref. 1 & 2 for example), but there have been very few examples of such items being commercially available. This paper describes the design of a number of GaAs MMICs and the assembly of these parts into multi-chip modules built specifically as cost-effective products. Specific examples of driven multi-throw switches for EW, communications and test equipment applications are given together with details of amplifier modules containing voltage regulation and temperature compensation.
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