使用大气纯氧等离子体对高级封装进行解封,实现真正的根本原因故障分析

Lea Heusinger-Jonda, Jiaqi Tang, K. Beenakker
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引用次数: 0

摘要

在过去的几年中,已经进行了几个失效分析案例研究,说明了通过无伪影解封术保存根本原因证据的重要性。本文介绍了其中三项研究的结果。在一个案例中,失败的根本原因是氯污染。在另一种情况下,它是腐蚀和金属迁移的结合。第三个案例涉及EOS故障,其证据被隐藏在一层碳化的模具化合物下。除了案例研究之外,文章还包括比较不同解封装方法结果的图像。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages
Several failure analysis case studies have been conducted over the past few years, illustrating the importance of preserving root-cause evidence by means of artifact-free decapsulation. The findings from three of those studies are presented in this article. In one case, the root cause of failure is chlorine contamination. In another, it is a combination of corrosion and metal migration. The third case involves an EOS failure, the evidence of which was hidden under a layer of carbonized mold compound. In addition to case studies, the article also includes images that compare the results of different decapsulation methods.
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