DARPA毫米波数字阵列(MIDAS)计划

2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) Pub Date : 2020-11-16 DOI:10.1109/BCICTS48439.2020.9392956

T. Hancock, Steven Gross, J. McSpadden, L. Kushner, J. Milne, J. Hacker, Ryan Walsh, C. Hornbuckle, C. Campbell, K. Kobayashi

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引用次数: 4

摘要

DARPA毫米波数字阵列(MIDAS)项目正在演示覆盖18-50 GHz频段的首个元件级数字毫米波相控阵。他们利用复合半导体、CMOS和异构集成来满足严格的尺寸和功率限制，同时推动最先进的射频和混合信号设计。4×4元件双极化收发器模块将成为可扩展阵列移动对移动自组织网络和新兴的低地球轨道(LEO)卫星通信的构建模块。元件级数字波束形成具有实现多波束操作的潜力，可减少网络发现时间并提高网络吞吐量。

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The DARPA Millimeter Wave Digital Arrays (MIDAS) Program

The DARPA Millimeter Wave Digital Arrays (MIDAS) program is demonstrating the first element level digital millimeter wave phased arrays covering the 18–50 GHz band. The performers are leveraging compound semiconductors, CMOS and heterogeneous integration to meet the stringent size and power constraints while pushing the state-of-the-art in RF and mixed-signal design. The 4×4 element dual-polarized transceiver tile will be a building block to enable scalable arrays mobile-to-mobile ad-hoc networking and emerging proliferated low-earth orbit (LEO) satcom. Element-level digital beamforming has the potential to enable multi-beam operation for reduced network discovery time and increased network throughput.

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2020 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

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