L. Anderson, S. Parikh, S. Nagalingam, C. Haidinyak
{"title":"在0.8 /spl mu/m的BiCMOS工艺中,使用三角电压扫描使钠离子减少100/spl倍的案例研究","authors":"L. Anderson, S. Parikh, S. Nagalingam, C. Haidinyak","doi":"10.1109/IRWS.1995.493574","DOIUrl":null,"url":null,"abstract":"This case study shows how to use Triangular Voltage Sweep (TVS) to reduce Na and K in the backend of a triple-metal BiCMOS process from 10/sup 12/ ions/cm/sup 2/ to 10/sup 10/ ions/cm/sup 2/. TVS is compared to Bias Temperature Stress (BTS) techniques. While Capacitance-Voltage plots are good monitors for bulk contamination (metal, deposited oxide, etc.), data is presented which shows that TVS is superior for detecting surface-introduced mobile ions (photoresist, solvent strip, etc.). Process integration techniques and issues in the reduction of mobile ions are discussed. When TVS structures are put on product-like wafers, the mobile ions can be measured accurately and repeatably within 10 minutes of completing the process step-no alloy is required! Finally, the use of Ammonium Fluoride solutions to reduce the surface mobile ions are discussed.","PeriodicalId":355898,"journal":{"name":"IEEE 1995 International Integrated Reliability Workshop. Final Report","volume":"97 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A case study in a 100/spl times/reduction in sodium ions in a 0.8 /spl mu/m BiCMOS process using triangular voltage sweep\",\"authors\":\"L. Anderson, S. Parikh, S. Nagalingam, C. Haidinyak\",\"doi\":\"10.1109/IRWS.1995.493574\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This case study shows how to use Triangular Voltage Sweep (TVS) to reduce Na and K in the backend of a triple-metal BiCMOS process from 10/sup 12/ ions/cm/sup 2/ to 10/sup 10/ ions/cm/sup 2/. TVS is compared to Bias Temperature Stress (BTS) techniques. While Capacitance-Voltage plots are good monitors for bulk contamination (metal, deposited oxide, etc.), data is presented which shows that TVS is superior for detecting surface-introduced mobile ions (photoresist, solvent strip, etc.). Process integration techniques and issues in the reduction of mobile ions are discussed. When TVS structures are put on product-like wafers, the mobile ions can be measured accurately and repeatably within 10 minutes of completing the process step-no alloy is required! Finally, the use of Ammonium Fluoride solutions to reduce the surface mobile ions are discussed.\",\"PeriodicalId\":355898,\"journal\":{\"name\":\"IEEE 1995 International Integrated Reliability Workshop. Final Report\",\"volume\":\"97 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-10-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 1995 International Integrated Reliability Workshop. Final Report\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRWS.1995.493574\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 1995 International Integrated Reliability Workshop. Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRWS.1995.493574","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A case study in a 100/spl times/reduction in sodium ions in a 0.8 /spl mu/m BiCMOS process using triangular voltage sweep
This case study shows how to use Triangular Voltage Sweep (TVS) to reduce Na and K in the backend of a triple-metal BiCMOS process from 10/sup 12/ ions/cm/sup 2/ to 10/sup 10/ ions/cm/sup 2/. TVS is compared to Bias Temperature Stress (BTS) techniques. While Capacitance-Voltage plots are good monitors for bulk contamination (metal, deposited oxide, etc.), data is presented which shows that TVS is superior for detecting surface-introduced mobile ions (photoresist, solvent strip, etc.). Process integration techniques and issues in the reduction of mobile ions are discussed. When TVS structures are put on product-like wafers, the mobile ions can be measured accurately and repeatably within 10 minutes of completing the process step-no alloy is required! Finally, the use of Ammonium Fluoride solutions to reduce the surface mobile ions are discussed.