多晶硅微动力齿轮系统的研制与改进

M. Avram, O. Neagoe, M. Simion
{"title":"多晶硅微动力齿轮系统的研制与改进","authors":"M. Avram, O. Neagoe, M. Simion","doi":"10.1109/SMICND.1996.557310","DOIUrl":null,"url":null,"abstract":"The purpose of this research was to design and fabricate a microdynamic system of three polysilicon gear wheels, using a three masks process for silicon microfabrication. The fabrication sequence of the micromechanical system is following the process described by Fan(1988) for micromachining detachable moving parts on silicon substrates. The basis for fabricating of movable parts is the use of sacrificial layers that act as spacers and they also keep the parts attached to the wafer during fabrication.","PeriodicalId":266178,"journal":{"name":"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings","volume":"322 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Fabrication and improvement of polysilicon microdynamic gear wheels system\",\"authors\":\"M. Avram, O. Neagoe, M. Simion\",\"doi\":\"10.1109/SMICND.1996.557310\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The purpose of this research was to design and fabricate a microdynamic system of three polysilicon gear wheels, using a three masks process for silicon microfabrication. The fabrication sequence of the micromechanical system is following the process described by Fan(1988) for micromachining detachable moving parts on silicon substrates. The basis for fabricating of movable parts is the use of sacrificial layers that act as spacers and they also keep the parts attached to the wafer during fabrication.\",\"PeriodicalId\":266178,\"journal\":{\"name\":\"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings\",\"volume\":\"322 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.1996.557310\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.1996.557310","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本研究的目的是设计和制造一个由三个多晶硅齿轮组成的微动力系统,采用硅微加工的三掩模工艺。微机械系统的制造顺序遵循Fan(1988)在硅基板上对可拆卸移动部件进行微加工的过程。制造可移动部件的基础是使用牺牲层作为间隔层,并在制造过程中使部件附着在晶圆上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication and improvement of polysilicon microdynamic gear wheels system
The purpose of this research was to design and fabricate a microdynamic system of three polysilicon gear wheels, using a three masks process for silicon microfabrication. The fabrication sequence of the micromechanical system is following the process described by Fan(1988) for micromachining detachable moving parts on silicon substrates. The basis for fabricating of movable parts is the use of sacrificial layers that act as spacers and they also keep the parts attached to the wafer during fabrication.
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