移动掩模深x射线光刻三维仿真系统

Y. Hirai, N. Matsuzuka, S. Hafizovic, J. Korvink, O. Tabata
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引用次数: 2

摘要

提出了一种新的移动掩模深x射线光刻(M/sup 2/DXL)技术三维仿真系统。新开发的x射线光刻模拟系统名为三维制造x射线光刻模拟系统(X3D),是针对M/sup 2/DXL技术模拟三维微结构制造过程而量身定制的。我们对开发模块采用了快速行军的方法,并证实X3D正确地预测了暴露PMMA的3D溶解过程。介绍了X3D技术的发展概况和快速推进法预测三维微结构的新方法,并对仿真结果进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3D simulation system for moving mask deep X-ray lithography
This paper presents a new 3-dimensional (3D) simulation system for moving mask deep X-ray lithography (M/sup 2/DXL) technique. The newly developed X-ray lithography simulation system named X-ray lithography simulation system for 3-dimensional fabrication (X3D) is tailored to simulate the fabrication process of 3D microstructures using the M/sup 2/DXL technique. We have adopted the fast marching method for the development module, and confirmed that X3D correctly predicts the 3D dissolution process of exposed PMMA. A general overview on the X3D, the new approach with the fast marching method to predict 3D microstructures, and the verification of the simulation result are presented.
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