{"title":"微流控RF层压板用聚合物基板的金属化","authors":"S. Long, W. M. Dorsey, André A. Adams, G. Huff","doi":"10.1109/ICICDT.2014.6838591","DOIUrl":null,"url":null,"abstract":"A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.","PeriodicalId":325020,"journal":{"name":"2014 IEEE International Conference on IC Design & Technology","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Metallization of a polymer substrate for microfluidic-cooled RF laminates\",\"authors\":\"S. Long, W. M. Dorsey, André A. Adams, G. Huff\",\"doi\":\"10.1109/ICICDT.2014.6838591\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.\",\"PeriodicalId\":325020,\"journal\":{\"name\":\"2014 IEEE International Conference on IC Design & Technology\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE International Conference on IC Design & Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICICDT.2014.6838591\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE International Conference on IC Design & Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICICDT.2014.6838591","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Metallization of a polymer substrate for microfluidic-cooled RF laminates
A new method for metallization of a polymer substrate has been demonstrated. This method allows for RF devices, including integrated circuits, to be fabricated on substrates which may feature microfluidic channels for cooling. Conventional hot-embossing was used to integrate copper mesh into a poly(methyl methacrylate) (PMMA), forming a microwave laminate. The laminate was machined into a microstrip patch antenna with a resonant frequency of 2.916 GHz.
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