低温热压粘接用金疙瘩的表面处理

2018 7th Electronic System-Integration Technology Conference (ESTC) Pub Date : 2018-09-01 DOI:10.1109/ESTC.2018.8546419

Juliane Föhlich, L. Dietrich, H. Oppermann, K. Lang

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引用次数: 3

摘要

对不同几何形状的金触点进行了热压键合试验。在粘合之前，表面被机械平面化，并通过大气等离子体激活。这些处理在160°C的温度和100 MPa的压力下，在短时间(10s)的粘合下，获得了优异的剪切强度(约50MPa)。

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surface treatment of gold bumps for thermocompression bonding with low temperature

Trials were made for thermocompression bonding of gold contacts with different geometries. Prior to bonding, the surfaces were mechanically planarized and activated by means of an atmospheric plasma. These treatments enabled excellent shear strengths (about 50MPa) after bonding at a temperature of 160°C and a pressure of 100 MPa for short bond times (10s).

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2018 7th Electronic System-Integration Technology Conference (ESTC)

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