{"title":"应用积分分析技术确定先进封装的信号和功率完整性","authors":"N. Nenadovic, E. Miersch, M. Versleijen, S. Wane","doi":"10.1109/EPEP.2007.4387155","DOIUrl":null,"url":null,"abstract":"In this paper an application of an integral analysis technique is demonstrated for determining signal integrity (SI) and power integrity (PI) of complex and advanced package solutions. A representative system-in-package (SiP) product has been selected as a carrier for our study, which is focused on analysis methodology, tools and flow. In particular, possibility to easily support what-if simulations for SI and PI, including analysis with distributed on-chip decoupling capacitors is investigated and highlighted. Importance of balancing between accuracy, CPU time and ease-of-use is also underlined.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Application of Integral Analysis Technique to Determine Signal- and Power Integrity of Advanced Packages\",\"authors\":\"N. Nenadovic, E. Miersch, M. Versleijen, S. Wane\",\"doi\":\"10.1109/EPEP.2007.4387155\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper an application of an integral analysis technique is demonstrated for determining signal integrity (SI) and power integrity (PI) of complex and advanced package solutions. A representative system-in-package (SiP) product has been selected as a carrier for our study, which is focused on analysis methodology, tools and flow. In particular, possibility to easily support what-if simulations for SI and PI, including analysis with distributed on-chip decoupling capacitors is investigated and highlighted. Importance of balancing between accuracy, CPU time and ease-of-use is also underlined.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"96 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387155\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387155","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Application of Integral Analysis Technique to Determine Signal- and Power Integrity of Advanced Packages
In this paper an application of an integral analysis technique is demonstrated for determining signal integrity (SI) and power integrity (PI) of complex and advanced package solutions. A representative system-in-package (SiP) product has been selected as a carrier for our study, which is focused on analysis methodology, tools and flow. In particular, possibility to easily support what-if simulations for SI and PI, including analysis with distributed on-chip decoupling capacitors is investigated and highlighted. Importance of balancing between accuracy, CPU time and ease-of-use is also underlined.
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