{"title":"用时域有限差分法对接地介质表面波进行数值分析","authors":"C. Schuster, W. Fichtner","doi":"10.1109/EPEP.1999.819201","DOIUrl":null,"url":null,"abstract":"In this paper, the FDTD method is used to analyze the electromagnetic behavior of surface waves on a grounded dielectric plane. Dispersion characteristics, scattering from plane truncations, excitation and interference on a microstrip right angle bend are discussed. The knowledge of these fundamental properties is essential if one wishes to optimize the electrical performance of packages and interconnects with respect to surface wave crosstalk and radiation losses.","PeriodicalId":299335,"journal":{"name":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Numerical analysis of surface waves on a grounded dielectric plane using the finite difference time domain method\",\"authors\":\"C. Schuster, W. Fichtner\",\"doi\":\"10.1109/EPEP.1999.819201\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the FDTD method is used to analyze the electromagnetic behavior of surface waves on a grounded dielectric plane. Dispersion characteristics, scattering from plane truncations, excitation and interference on a microstrip right angle bend are discussed. The knowledge of these fundamental properties is essential if one wishes to optimize the electrical performance of packages and interconnects with respect to surface wave crosstalk and radiation losses.\",\"PeriodicalId\":299335,\"journal\":{\"name\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-10-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.1999.819201\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1999.819201","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Numerical analysis of surface waves on a grounded dielectric plane using the finite difference time domain method
In this paper, the FDTD method is used to analyze the electromagnetic behavior of surface waves on a grounded dielectric plane. Dispersion characteristics, scattering from plane truncations, excitation and interference on a microstrip right angle bend are discussed. The knowledge of these fundamental properties is essential if one wishes to optimize the electrical performance of packages and interconnects with respect to surface wave crosstalk and radiation losses.