在衬底中集成双极元件的硅对硅多芯片模块技术

Proceedings of IEEE Multi-Chip Module Conference (MCMC-94) Pub Date : 1994-03-15 DOI:10.1109/MCMC.1994.292525

R. Day, C.D. Hruska, K. Tai, R. Frye, M. Lau, P. Sullivan

{"title":"在衬底中集成双极元件的硅对硅多芯片模块技术","authors":"R. Day, C.D. Hruska, K. Tai, R. Frye, M. Lau, P. Sullivan","doi":"10.1109/MCMC.1994.292525","DOIUrl":null,"url":null,"abstract":"To address the needs of cost driven, mixed signal applications, we have developed a silicon-on-silicon technology that incorporates both passive and active devices in the module substrate. The technology combines a simple, double-diffused epitaxial bipolar technology with our thin-film MCMs. We describe the basic elements of the technology, typical active device properties and some examples of their use in a low-cost MCM.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"31 3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"A silicon-on-silicon multichip module technology with integrated bipolar components in the substrate\",\"authors\":\"R. Day, C.D. Hruska, K. Tai, R. Frye, M. Lau, P. Sullivan\",\"doi\":\"10.1109/MCMC.1994.292525\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"To address the needs of cost driven, mixed signal applications, we have developed a silicon-on-silicon technology that incorporates both passive and active devices in the module substrate. The technology combines a simple, double-diffused epitaxial bipolar technology with our thin-film MCMs. We describe the basic elements of the technology, typical active device properties and some examples of their use in a low-cost MCM.<<ETX>>\",\"PeriodicalId\":292463,\"journal\":{\"name\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"volume\":\"31 3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1994.292525\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292525","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 20

摘要

为了满足成本驱动的混合信号应用的需求，我们开发了一种硅对硅技术，在模块衬底中集成了无源和有源器件。该技术将简单的双扩散外延双极技术与我们的薄膜mcm相结合。我们描述了该技术的基本要素，典型的有源器件特性以及它们在低成本MCM中的一些应用实例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A silicon-on-silicon multichip module technology with integrated bipolar components in the substrate

To address the needs of cost driven, mixed signal applications, we have developed a silicon-on-silicon technology that incorporates both passive and active devices in the module substrate. The technology combines a simple, double-diffused epitaxial bipolar technology with our thin-film MCMs. We describe the basic elements of the technology, typical active device properties and some examples of their use in a low-cost MCM.<>

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)

自引率

0.00%

发文量