B. Burke, R. Mountain, D. Harrison, J. Reinold, C. Doherty, G. Ricker, M. Bautz, J. Doty
{"title":"可用于可见光和x射线焦平面阵列的CCD成像仪","authors":"B. Burke, R. Mountain, D. Harrison, J. Reinold, C. Doherty, G. Ricker, M. Bautz, J. Doty","doi":"10.1109/ISSCC.1989.48196","DOIUrl":null,"url":null,"abstract":"Large multichip arrays for close-abutted CCDs (charged-coupled devices) are needed for surveillance applications in the visible band and for X-ray astronomy missions such as the Advanced X-ray Astrophysics Facility and the ASTRO-D satellite. A 420*420 pixel frame-transfer CCD imager which is designed to be abutted to other imagers on three sides so that arrays of 2*N chips can be constructed has been developed. A three-phase, triple-poly, buried-channel process is used, and the die size is 12 mm*20 mm. The arrays provide low-noise readout circuitry and high charge-transfer efficiency at low charge levels, critical requirements for both of the above applications. The device has also been shown to be suitable as a soft X-ray imager operating in a spectroscopic mode.<<ETX>>","PeriodicalId":385838,"journal":{"name":"IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-02-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"112","resultStr":"{\"title\":\"An abuttable CCD imager for visible and X-ray focal plane arrays\",\"authors\":\"B. Burke, R. Mountain, D. Harrison, J. Reinold, C. Doherty, G. Ricker, M. Bautz, J. Doty\",\"doi\":\"10.1109/ISSCC.1989.48196\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Large multichip arrays for close-abutted CCDs (charged-coupled devices) are needed for surveillance applications in the visible band and for X-ray astronomy missions such as the Advanced X-ray Astrophysics Facility and the ASTRO-D satellite. A 420*420 pixel frame-transfer CCD imager which is designed to be abutted to other imagers on three sides so that arrays of 2*N chips can be constructed has been developed. A three-phase, triple-poly, buried-channel process is used, and the die size is 12 mm*20 mm. The arrays provide low-noise readout circuitry and high charge-transfer efficiency at low charge levels, critical requirements for both of the above applications. The device has also been shown to be suitable as a soft X-ray imager operating in a spectroscopic mode.<<ETX>>\",\"PeriodicalId\":385838,\"journal\":{\"name\":\"IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-02-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"112\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.1989.48196\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Solid-State Circuits Conference, 1989 ISSCC. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1989.48196","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An abuttable CCD imager for visible and X-ray focal plane arrays
Large multichip arrays for close-abutted CCDs (charged-coupled devices) are needed for surveillance applications in the visible band and for X-ray astronomy missions such as the Advanced X-ray Astrophysics Facility and the ASTRO-D satellite. A 420*420 pixel frame-transfer CCD imager which is designed to be abutted to other imagers on three sides so that arrays of 2*N chips can be constructed has been developed. A three-phase, triple-poly, buried-channel process is used, and the die size is 12 mm*20 mm. The arrays provide low-noise readout circuitry and high charge-transfer efficiency at low charge levels, critical requirements for both of the above applications. The device has also been shown to be suitable as a soft X-ray imager operating in a spectroscopic mode.<>