J. Dziewierz, S. Ramadas, A. Gachagan, R. O’Leary, G. Hayward
{"title":"基于六边形单元和三角切割的压电复合材料子结构的二维超声阵列设计","authors":"J. Dziewierz, S. Ramadas, A. Gachagan, R. O’Leary, G. Hayward","doi":"10.1109/ULTSYM.2009.5441447","DOIUrl":null,"url":null,"abstract":"Contemporary 2D Ultrasonic arrays suffer from low SNR and limited steering capabilities. Yet, there is a great desire in the industry to increase the operational frequency, in order to enhance their volumetric imaging resolution. State-of-the art arrays use an orthogonal matrix of rectangular elements as this is a natural step forward from the conventional 1D array structure. The objective of this work is to evaluate properties of triangular, rather than rectangular ceramic pillars in a 1–3 connectivity piezoelectric composite for application in a hexagonal-element 2D array. A 3MHz prototype device exploiting new hexagonal substructure have been manufactured. Measured mechanical cross-coupling level is −21.9dB between neighbouring hexagonal elements, providing validation of simulation result. Corroboration between measured and FE modelled device behaviour is demonstrated.","PeriodicalId":368182,"journal":{"name":"2009 IEEE International Ultrasonics Symposium","volume":"173 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A 2D Ultrasonic array design incorporating hexagonal-shaped elements and triangular-cut piezocomposite substructure for NDE applications\",\"authors\":\"J. Dziewierz, S. Ramadas, A. Gachagan, R. O’Leary, G. Hayward\",\"doi\":\"10.1109/ULTSYM.2009.5441447\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Contemporary 2D Ultrasonic arrays suffer from low SNR and limited steering capabilities. Yet, there is a great desire in the industry to increase the operational frequency, in order to enhance their volumetric imaging resolution. State-of-the art arrays use an orthogonal matrix of rectangular elements as this is a natural step forward from the conventional 1D array structure. The objective of this work is to evaluate properties of triangular, rather than rectangular ceramic pillars in a 1–3 connectivity piezoelectric composite for application in a hexagonal-element 2D array. A 3MHz prototype device exploiting new hexagonal substructure have been manufactured. Measured mechanical cross-coupling level is −21.9dB between neighbouring hexagonal elements, providing validation of simulation result. Corroboration between measured and FE modelled device behaviour is demonstrated.\",\"PeriodicalId\":368182,\"journal\":{\"name\":\"2009 IEEE International Ultrasonics Symposium\",\"volume\":\"173 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE International Ultrasonics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ULTSYM.2009.5441447\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE International Ultrasonics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ULTSYM.2009.5441447","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 2D Ultrasonic array design incorporating hexagonal-shaped elements and triangular-cut piezocomposite substructure for NDE applications
Contemporary 2D Ultrasonic arrays suffer from low SNR and limited steering capabilities. Yet, there is a great desire in the industry to increase the operational frequency, in order to enhance their volumetric imaging resolution. State-of-the art arrays use an orthogonal matrix of rectangular elements as this is a natural step forward from the conventional 1D array structure. The objective of this work is to evaluate properties of triangular, rather than rectangular ceramic pillars in a 1–3 connectivity piezoelectric composite for application in a hexagonal-element 2D array. A 3MHz prototype device exploiting new hexagonal substructure have been manufactured. Measured mechanical cross-coupling level is −21.9dB between neighbouring hexagonal elements, providing validation of simulation result. Corroboration between measured and FE modelled device behaviour is demonstrated.