先进芯片设计中模式传输技术的最新进展与挑战

A. Sinha
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引用次数: 0

摘要

只提供摘要形式。即使摩尔定律继续推动“微小技术”的不断扩展,半导体芯片的主要技术驱动力已经从dram发展到微处理器,再到fpga。基本的度量标准已经从计算机的每芯片位和每比特成本演变为消费产品的每芯片功能和每功能成本。演讲回顾了在新的300mm晶圆上实现模式转移技术方面取得的显著进展,包括掩模设计,光刻增强和精密蚀刻,用于越来越多的新材料。然而,所有这些都是有成本的,成本效益的权衡几乎肯定会推动整个食物链的新变化,这是作者试图确定的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Recent Progress and Remaining Challenges in Pattern Transfer Technologies for Advanced Chip Designs
Summary form only given. Even as Moore's law continues to drive "tiny technologies" through relentless scaling, the main technology driver for semiconductor chips has evolved from DRAMs to microprocessors to FPGAs. The underlying metrics have evolved from bits per chip and cost per bit for computers to functions per chip and cost per function for consumer products. The talk reviews the remarkable progress that has been made in enabling pattern transfer technologies, including mask design, lithography enhancements and precision etching, on the new 300 mm wafers for an increasingly wide variety of new materials. However, there is a cost associated with all this and the cost-benefit tradeoffs will almost certainly drive new inflections in the entire food chain, which the author tries to identify.
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