电子封装制造成本分析

{"title":"电子封装制造成本分析","authors":"S. Marallo, J. Dieffenbach","doi":"10.1109/ICEDTM.1994.496096","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":319739,"journal":{"name":"Proceedings of 3rd International Workshop on the Economics of Design, Test and Manufacturing","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Manufacturing cost analysis for electronic packaging\",\"authors\":\"S. Marallo, J. Dieffenbach\",\"doi\":\"10.1109/ICEDTM.1994.496096\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":319739,\"journal\":{\"name\":\"Proceedings of 3rd International Workshop on the Economics of Design, Test and Manufacturing\",\"volume\":\"51 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-05-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 3rd International Workshop on the Economics of Design, Test and Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEDTM.1994.496096\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 3rd International Workshop on the Economics of Design, Test and Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEDTM.1994.496096","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}