InAlAs/InGaAs modfet的击穿物理

S. Bahl, J. D. del Alamo, J. Dickmann, S. Schildberg
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引用次数: 2

摘要

详细研究了最先进的晶格匹配和伪晶InAlAs/InGaAs modfet的脱态击穿物理。研究发现,与异质结雪崩光电二极管类似,这些器件的击穿是一个两步过程。首先,电子通过热场发射从栅极注入到通道中。其次,由于较大的导带偏移和绝缘体中的电场,这些电子进入通道时很热,并立即通过冲击电离释放能量。研究结果表明,通过使用高势垒低inas绝缘体、更厚的未掺杂势垒层以及通过量子约束增强通道带隙,InAlAs/InGaAs modfet的击穿电压工程具有相当大的空间。>
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Physics of breakdown in InAlAs/InGaAs MODFETs
A detailed study of the physics of off-state breakdown in state-of-the-art lattice-matched and pseudomorphic InAlAs/InGaAs MODFETs is presented. It is found that, similarly to heterojunction avalanche photodiodes, breakdown in these devices is a two-step process. First, electrons are injected from the gate into the channel through thermionic-field emission. Second, because of the large conduction-band offset and the electric field in the insulator, these electrons enter the channel hot and immediately relax their energy through impact-ionization. The findings obtained suggest that there is considerable room for breakdown voltage engineering in InAlAs/InGaAs MODFETs by the use of a higher-barrier low-InAs insulator, a thicker undoped barrier-layer, and enhancement of the channel bandgap by quantum confinement. >
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