热冲击试验下封装倒装芯片的可靠性及新型失效模式

Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Pub Date : 1900-01-01 DOI:10.1109/EPTC.2003.1298772

C. Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, W. Kempe

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引用次数: 5

摘要

本文通过对不同材料/工艺组合(下填充、助熔剂、回流气氛)的研究，探讨了板上倒装芯片(FCOB)组件在热冲击试验下的热机械可靠性。验证了焊点疲劳是主要的失效机制，分层对焊点寿命有明显的不利影响。本研究首次报道了周期性焊点裂纹，并确定与PCB中的玻璃纤维分布有关。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Reliability and new failure modes of encapsulated flip chip on board under thermal shock testing

The thermomechanical reliability of flip chip on board (FCOB) assembly under thermal shock test is addressed in this paper by investigation of different material/process combinations (underfill, flux, reflow atmospheres). It is verified that solder fatigue is the dominate failure mechanism and delamination has obvious adverse effect on the solder joint lifetime. Periodic solder joint crack is first reported in this study and is determined to be related to glass fiber distribution in the PCB.

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Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.

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