根据成本和性能优化选择封装技术和电路分区

APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058) Pub Date : 2000-02-06 DOI:10.1109/APEC.2000.826079

J. Jacobsen, D. Hopkins

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引用次数: 14

摘要

大多数电力电子电路采用两种或多种电力电子封装技术进行封装。为了最佳地选择和使用几种技术，以最低的成本满足性能要求，需要对电路进行战略性划分。提出了一种基于相对成本图的技术优化选择的结构化方法。其他因素，如性能、产品体积和模块化也包括在内。

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Optimally selecting packaging technologies and circuit partitions based on cost and performance

Most power electronics circuits are packaged using two or more power electronics packaging technologies. To optimally select and use several technologies that meet performance requirements at minimum cost requires a strategic partitioning of the circuit. Presented is a structured technique for optimally selecting technologies based on a relative cost diagram. Other factors, such as performance, product volume and modularity are included.

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APEC 2000. Fifteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.00CH37058)

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