{"title":"高压SiC功率器件的最新进展","authors":"T. Chow, N. Ramungul, M. Ghezzo","doi":"10.1109/HTEMDS.1998.730653","DOIUrl":null,"url":null,"abstract":"The present status of high-voltage SiC semiconductor switching devices is reviewed. The figures of merit that have been used for unipolar and bipolar devices to quantify the intrinsic performance improvement over silicon are presented. The choice and design of several key device structures are discussed. The performance expectations of the major two- and three-terminal unipolar and bipolar devices in 4H-SiC are presented. The recent rapid development of SiC material and process technology is described. The progress in high-voltage power device experimental demonstration is reviewed. The material and process technology issues that must be addressed for device commercialization are discussed.","PeriodicalId":197749,"journal":{"name":"1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)","volume":"148 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-02-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Recent advances in high-voltage SiC power devices\",\"authors\":\"T. Chow, N. Ramungul, M. Ghezzo\",\"doi\":\"10.1109/HTEMDS.1998.730653\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The present status of high-voltage SiC semiconductor switching devices is reviewed. The figures of merit that have been used for unipolar and bipolar devices to quantify the intrinsic performance improvement over silicon are presented. The choice and design of several key device structures are discussed. The performance expectations of the major two- and three-terminal unipolar and bipolar devices in 4H-SiC are presented. The recent rapid development of SiC material and process technology is described. The progress in high-voltage power device experimental demonstration is reviewed. The material and process technology issues that must be addressed for device commercialization are discussed.\",\"PeriodicalId\":197749,\"journal\":{\"name\":\"1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)\",\"volume\":\"148 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-02-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HTEMDS.1998.730653\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HTEMDS.1998.730653","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The present status of high-voltage SiC semiconductor switching devices is reviewed. The figures of merit that have been used for unipolar and bipolar devices to quantify the intrinsic performance improvement over silicon are presented. The choice and design of several key device structures are discussed. The performance expectations of the major two- and three-terminal unipolar and bipolar devices in 4H-SiC are presented. The recent rapid development of SiC material and process technology is described. The progress in high-voltage power device experimental demonstration is reviewed. The material and process technology issues that must be addressed for device commercialization are discussed.