212gbps芯片到模块信道的可行性分析

F. de Paulis, Rick Rabinovich, R. Mellitz, M. Resso
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引用次数: 2

摘要

对更高通信数据速率的不断增长的需求要求更好(更宽的带宽)的信道,发射机和接收机的噪声和均衡。当需要标准化的接口的每次迭代都期望数据速率翻倍时,这种情况就会加剧,就像以太网通信一样。本文重点介绍了基于芯片到模块(C2M)接口实现200 Gbps可靠信道通信的可能策略,该接口通常用于数据中心。分析了信道插入和回波损耗、串扰干扰信道数量、Tx和Rx舰船的噪声质量和先进均衡方案之间的预算。为下一代以太网通信的200 Gbps信道可靠工作,将提出信道架构要求设置指南。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Feasibility Analysis of Chip-to-Module Channel Operating at 212 Gbps
The ever-growing demand for higher communication data rates calls for better (wider bandwidth) channels, transmitter and receiver noise and equalization. This is exacerbated when the data-rate is expected to double at each iteration of the interface to be standardized, as it is happening for the Ethernet communications. This paper highlights possible strategies for achieving a reliable channel communication at 200 Gbps based on the Chip-to-Module (C2M) interface typically found in data centers. The budgeting among the channel insertion and return losses, number of crosstalk aggressor channels, quality of Tx and Rx ships in terms of noise and advanced equalization schemes will be analyzed. Guidelines for settings the requirements of the channel architecture will be proposed for the channel reliably working at 200 Gbps for the next generation Ethernet communications.
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